Specifications:Layers: 1Thickness:1.6mmMaterial: Aluminum KBSize:
60*60mmSurface treatment:ospLine width/spacing: 6/6milMinimum
aperture: 0.25mmSolder mask color: WhiteFinished copper thickness:
inner layer 1 OZ, outer layer 1 OZFeatures:1. The integration of
the board design is very high, the thickness-to-diameter ratio
exceeds 10:1, and the difficulty of electroplating of copper is
high.2. Made of TG170 materialShenzhen XMD Circuits Co.,Ltd,
previously known as Jaleny(jlypcb), was founded in 2009 and started
the journey of circuit board in Shenzhen,China. Through the
introduction of advanced production and testing equipment and
technical exchanges with factories in the same industry and
engineering colleges, XMD greatly expanded the process capacity of
double-sided board and multi-layer board. In 2011, we began to
explore overseas markets and export foreign orders to all parts of
the world. In 2018, Jiangxi Ji'an added a new production line,
mainly making batch orders.Able to produce 50,000 sqm of PCBs
monthlyOne-stop solutions for clients (PCB & PCBA)Over 12 years of
Experience in PCBsAvg Response time: ≤24 h (experienced Engineers
to Serve you)Comply with RoHS,TS16949,ISO9001 and UL
certifications.Flexibilities in Shipment Arrangement (FOB HK or
Shenzhen by sea or by air, CIF via DHL,Fedex,UPS or TNT
etc.) A professional team, using automation, digitization to
greatly improve pcb production efficiency and reduce PCB
procurement costs.High-quality Raw Material★Traceable source of
branded raw material★Standardized procurement process★Strict
supplier selection policyProduction Equipment★High precision
processing equipment★Efficient operation guarantees quality★Meet
various special technical processesIntelligent System★Intelligent
audition★Intelligent CAM★Intelligent paneling★Intelligent
productionStrict Inspection★100% AOI testing★100% FQA/FQC★Quality
Control★'Failed One Lost Ten' Our Capabilities and
TechnologyItems20222023Layers(MP):22layer,(Sampling):32
layer(MP):32layerMax. Board THKSampling 4.0mm / MP :3.2mmSampling
5.0mm / MP:3.2mmMin. Board THKSampling :0.4mm /MP :0.5mmSampling:
0.3mm / MP:0.4mmBase copperInner layer1/3 ~ 6OZ1/3~8 OZOuter
layer1/3 ~ 6 OZ1/3 ~ 8 OZBorehole diameterMin.PTH0.2mm0.15mmMax.
aspect ratio10:0112:01HDI aspect ratio0.8:11:01Tolerances
PTH±0.076mm±0.05mm NPTH±0.05mm±0.03mmSolder mask
opening0.05mm0.03mmSolder dam(Green) 0.076mm ,(Green) 0.076mm
,(other color) 0.1mm(other color) 0.08mmMin. core
THK.0.1mm0.08mmBow&twist≤0.5%≤0.5%Routing Tol. Sampling
:±0.075mm /MP:±0.1mmSampling:±0.075mm /MP:±0.075mmImpedance
Tol.±10%±8%Min. w/s (Inner layer)0.075 / 0.075mm0.075 / 0.075mmMin.
w/s (Outer layer)0.075 / 0.075mm0.075 / 0.075mm (Min. BGA
size)0.2mm0.15mm(pitch)(Min. BGA Pitch)0.65mm0.5mm(Working panel
size)600mm*700mm600mm*700mmSpecial processSplit gold fingers,
Counter-bore , Counter-sink, Back-Drill, POFV , Mech. Drilling
Blind hole. /* January 22, 2024 19:08:37
*/!function(){function s(e,r){var
a,o={};try{e&&e.split(",").forEach(function(e,t){e&&(a=e.match(/(.*?):(.*)$/))&&1
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